Articles

Litwin W., Schwarz T., Long D. (2012), Combining Chunk Boundary and Chunk Signature Calculations for Deduplication, Revista IEEE Latin America, vol. 10, n°1, p. 1305-1311

Communications avec actes

Litwin W. (2019), SQL for Stored and Inherited Relations, in J. Filipe, M. Smialek, A. Brodsky, S. Hammoudi, 21st International Conference on Enterprise Information Systems (ICEIS 2019), SciTePress, 37-48 p.

Jajodia S., Litwin W., Schwarz T. (2015), Numerical SQL Value Expressions Over Encrypted Cloud Databases, in Qiming Chen, Abdelkader Hameurlain, Farouk Toumani, Roland Wagner, Hendrik Decker, Database and Expert Systems Applications. 26th International Conference (DEXA 2015), Proceedings, Part II, Springer, 455-478 p.

Jajodia S., Litwin W., Schwarz T. (2014), Scalable Distributed Virtual Data Structures, in , 2014 ASE BIGDATA/SOCIALCOM/CYBERSECURITY Conference, Greensboro, NC, USA, Academy of Science and Engineering

Jajodia S., Litwin W., Schwarz T. (2013), Key Recovery Using Noised Secret Sharing with Discounts over Large Clouds, in L.W. Chang, Jaideep Srivastava, Justin Zhan, 2013 International Conference on Social Computing (SocialCom), IEEE - Institute of Electrical and Electronics Engineers, 700-707 p.

Jajodia S., Schwarz T., Litwin W. (2012), Securing password recovery through dispersion, in , 2012 Fourth International Conference on Computational Aspects of Social Networks (CASoN), proceedings, Sao Carlos, IEEE - Institute of Electrical and Electronics Engineers, 228-233 p.

Litwin W., Jajodia S., Schwarz T. (2012), Recoverable Encryption through Noised Secret over a Large Cloud, in Tjoa, A Min, Data Mangement in Cloud, Grid and P2P Systems 5th International Conference, Globe 2012, Vienna, Austria, September 5-6, 2012, Proceedings, Vienne, Springer, 13-24 p.

Bhagwat D., Long D., Zhang Z., Litwin W., Schwarz T. (2012), Improved deduplication through parallel binning, in , 2012 IEEE 31st International Performance Computing and Communications Conference (IPCCC), proceedings, Austin, IEEE - Institute of Electrical and Electronics Engineers, 130-141 p.